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ESD11A3.3DT5G SERIES
Transient Voltage
Suppressors
ESD Protection Diodes in Ultra Small
SOT ? 1123 Package
The ESD11A Series is designed to protect voltage sensitive
http://onsemi.com
components from damage due to ESD. These parts provide excellent
ESD clamping capability and fast response time to enhance the
immunity of the end application from system level ESD stress such as
IEC61000 ? 4 ? 2. Two uni ? directional TVS diodes are housed in the ultra
PIN 1. CATHODE
2. CATHODE
3. ANODE
1
2
3
small SOT ? 1123 package, making these parts ideal for ESD protection
on designs where board space is at a premium, such as cell phones, MP3
players and many other portable handheld electronic devices.
Specification Features:
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039” x 0.024” (1.0 mm x 0.6 mm)
? Low Body Height: 0.016 ″ (0.4 mm)
? Stand ? off Voltage: 3.3 V ? 5 V
? Low Leakage
? Response Time is Typically < 1 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? These are Pb ? Free Devices
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
Table 1. MAXIMUM RATINGS
MARKING
DIAGRAM
XM
SOT ? 1123
CASE 524AA
X = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping ?
ESD11AxxDT5G SOT ? 1123 8000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Symbol
Value
± 15
Unit
kV
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
° P D °
T stg
T J
T L
150
? 55 to +150
? 55 to +125
260
mW
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of ESD maximum ratings.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 3
1
Publication Order Number:
ESD11A3.3D/D
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